CN/EN

产品与市场

SP120N

特点

● 树脂流动度低、柔韧,不掉粉尘
剥离强度高,阻燃性达到UL94 V-0级
优秀的耐热性和电性能
优秀的加工性,可冲孔加工

应用领域

适用于阶梯板、多层刚挠结合印制电路板
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Items Method Condition Unit Typical Value
Tg 2.4.25D DSC

125
Td 2.4.24.6 5% wt. loss 315
T288
2.4.24.1 TMA min 3
T260 2.4.24.1
TMA min
30
Thermal Stress
2.4.13.1
288℃, solder dip
- after 6 cycles, no delamination
Volume Resistivity 2.5.17.1 C-96/35/90 MΩ.cm 5.0 x 108
Surface Resistivity
2.5.17.1
C-96/35/90 5.0 x 107
Peel Strength (1Oz) 2.4.8 288℃/10s N/mm 2.0
Water Absorption 2.6.2.1 E-1/105+D-24/23 % 0.15

Remarks:

All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning

The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in and the third digit the relative humidity.