CN/EN

产品与市场

S6015

特点

● 不含卤素,无玻纤增强材料,适用于常规HDI制作工艺
不掉树脂粉,污染少
可与常规FR-4.0半固化片媲美的保存期
较低的介电常数,有利于特性阻抗控制及提高信号传输速度

应用领域

适用于制作无卤化趋势的手持式电子产品,如手机、PDA、数码摄像机等
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Items Method Condition Unit Typical Value
Tg 2.4.25D DSC
145
Thermal Stress
2.4.13.1
288℃/20s
- pass
Dissipation Constant (1GHz) 2.5.5.9 C-24/23/50 - 3.4
Dissipation Factor (1GHz)
2.5.5.9
C-24/23/50
- 0.018
Volume Resistivity 2.5.17.1 C-96/35/90 MΩ.cm 5 x 108
Surface Resistivity
2.5.17.1
C-96/35/90 5 x 109
Peel Strength (1Oz) 2.4.8 288℃/10s N/mm 1.2
Flammability
UL94
C-48/23/50
Rating
V-0

Remarks:

All the typical values listed above are for your reference only and not intended for specification。 Please contact Shengyi Technology Co。, Ltd。 for detailed information。 All rights from this data sheet are reserved by Shengyi Technology Co。, Ltd。

Explanation:C=Humidity conditioning, D=Immersion conditioning in distilled water,E=Temperature conditioning

The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in and the third digit the relative humidity。