●  低介电常数,低传输损耗。

●  优秀的耐热性、耐化学性和电性能。

●  不含卤素,阻燃性达到 UL94 V-0 级 。

●  加工性好,适于快速压合和传统压合。

●  满足RoHS指令要求,不含铅、汞、镉、六价铬、多溴联苯、多溴联苯醚等。


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Items Method Condition Unit Typical Value
Peel Strength (90°)* IPC-TM-650 2.4.9D Accepted N/mm 0.92
288℃, 5s 0.92
Solder Resistance IPC-TM-650 2.4.13.F 288℃, 10s - No delamination
Dimensional Stability

SY Method

After peeling off the paper % -0.0223/-0.0393
Chemical Resistance IPC-TM-650 2.3.2G After Chemical Exposure % >85
Electric Strength IPC-TM-650 D-48/50+D-0.5/23 KV/mm 98
Volume Resistivity IPC-TM-650 2.5.17E C-96/35/90 MΩ-cm 4.19×109
Surface Resistance IPC-TM-650 2.5.17E C-96/35/90
Dielectric Constant (10GHz) SPDR C-24/23/50 - 2.7
Dissipation Factor (10GHz) SPDR C-24/23/50
- 0.004
Resin Flow IPC-TM-650 180℃/10+60s,100kg/cm2
mm <0.15
Flammability UL94 E-24/125 Rating V-0


*Testing after laminating with shining side of copper foil in suitablecondition

1.Certified to IPC-4203/2 Epoxy adhesive on one or twosides of poyimide dielectric

2.All the typical value listed above is for your reference only,please turn to Shengyi Technology Co., Ltd. for detailed information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

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